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Trenz Electronic GmbH
SoC Module with AMD Zynq™ 7020-2I incl. pre-assembled Heat Spreader(TE0729-03-62I63MAK)
TE0729-02-62I63MA SoC module including pre-assembled heat spreader, size: 5.2 x 7.6 cm
Item number VAR-827002570
Manufacturer Product Number: TE0729-03-62I63MAK
Taric/custom code: 84718090
Available for immediate dispatch: ${ $store.getters.currentItemVariation.stock.net }
Processing time 3 days. Possible to order, delivery time on request.
Item located in and dispatched from: Riedlingen, Germany
EUR 273.52
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Content
1 piece
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* Excl. VAT excl. Shipping
Item ID | 102171 |
Condition | New |
Legacy item ID | 3834 |
Model | TE0729-03-62I63MAK |
Manufacturer | Trenz Electronic GmbH |
Manufacturing country | Germany |
Content | 1 piece |
Weight | 157 g |
Net weight | 157 g |
Customs tariff number | 84718090 |
AXRF47 dev board & Kit based on AMD Zynq US+ RFSoC XCZU47DR
EUR 12,194.70 *
* Excl. VAT
excl.
Shipping
Special offer
Special offer
RYWB116_Lite: 2.4GHz Ultra Low Power Wi-Fi / Bluetooth 5.0 UART Interface Module with Integrated Antenna DIP Version
EUR 13.80 *
* Excl. VAT
excl.
Shipping
AXRF47 dev board & Kit based on AMD Zynq US+ RFSoC XCZU47DR
EUR 12,194.70 *
* Excl. VAT
excl.
Shipping
Special offer
Special offer
RYWB116_Lite: 2.4GHz Ultra Low Power Wi-Fi / Bluetooth 5.0 UART Interface Module with Integrated Antenna DIP Version
EUR 13.80 *
* Excl. VAT
excl.
Shipping
AXRF47 dev board & Kit based on AMD Zynq US+ RFSoC XCZU47DR
EUR 12,194.70 *
* Excl. VAT
excl.
Shipping
Special offer
Special offer
RYWB116_Lite: 2.4GHz Ultra Low Power Wi-Fi / Bluetooth 5.0 UART Interface Module with Integrated Antenna DIP Version
EUR 13.80 *
* Excl. VAT
excl.
Shipping
AXRF47 dev board & Kit based on AMD Zynq US+ RFSoC XCZU47DR
EUR 12,194.70 *
* Excl. VAT
excl.
Shipping
Special offer
Special offer
RYWB116_Lite: 2.4GHz Ultra Low Power Wi-Fi / Bluetooth 5.0 UART Interface Module with Integrated Antenna DIP Version
EUR 13.80 *
* Excl. VAT
excl.
Shipping
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