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Trenz Electronic GmbH
BGA Heat Sink for Trenz Electronic Module TE0724-04, 17 x 17 x 17.5 mm (ATS-X50170P-C1-R0)
High Performance maxiFLOW/superGRIP Heat Sink BGA Aluminum, Top Mount
Item number VAR-827001460
Manufacturer Product Number: ATS-X50170P-C1-R0
Taric/custom code: 84718090
Available for immediate dispatch: ${ $store.getters.currentItemVariation.stock.net }
Processing time 3 days. For orders with a total net value of less than 70 euros, we will charge a processing fee of 15 euros.
Item located in and dispatched from: Riedlingen, Germany
EUR 32.54
*
Content
1 piece
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Item ID | 101238 |
Condition | New |
Legacy item ID | 3432 |
Model | ATS-X50170P-C1-R0 |
Manufacturer | Trenz Electronic GmbH |
Manufacturing country | Germany |
Content | 1 piece |
Weight | 800 g |
Net weight | 800 g |
Customs tariff number | 84718090 |
UltraSOM+ MPSoC Module with AMD Zynq™ UltraScale+™ ZU15EG-1E, 4 GByte DDR4(TE0818-02-BBE81-A)
EUR 1,463.18 *
* Excl. VAT
excl.
Shipping
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EUR 9.50 *
* Excl. VAT
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UltraSOM+ MPSoC Module with AMD Zynq™ UltraScale+™ ZU15EG-1E, 4 GByte DDR4(TE0818-02-BBE81-A)
EUR 1,463.18 *
* Excl. VAT
excl.
Shipping
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EUR 373.71 *
* Excl. VAT
excl.
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EUR 9.50 *
* Excl. VAT
excl.
Shipping
UltraSOM+ MPSoC Module with AMD Zynq™ UltraScale+™ ZU15EG-1E, 4 GByte DDR4(TE0818-02-BBE81-A)
EUR 1,463.18 *
* Excl. VAT
excl.
Shipping
Digilent: MCC USB-TC: Thermocouple Measurement DAQ Device (thermocouple only)
EUR 373.71 *
* Excl. VAT
excl.
Shipping
UltraSOM+ MPSoC Module with AMD Zynq™ UltraScale+™ ZU15EG-1E, 4 GByte DDR4(TE0818-02-BBE81-A)
EUR 1,463.18 *
* Excl. VAT
excl.
Shipping
Digilent: MCC USB-TC: Thermocouple Measurement DAQ Device (thermocouple only)
EUR 373.71 *
* Excl. VAT
excl.
Shipping
UltraSOM+ MPSoC Module with AMD Zynq™ UltraScale+™ ZU15EG-1E, 4 GByte DDR4(TE0818-02-BBE81-A)
EUR 1,463.18 *
* Excl. VAT
excl.
Shipping
Digilent: MCC USB-TC: Thermocouple Measurement DAQ Device (thermocouple only)
EUR 373.71 *
* Excl. VAT
excl.
Shipping