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Heat Sink for Trenz Electronic FPGA Modules TE0741 Revision 04 und 05 (33013)
Please check assembly instructions! Heat dissipations Chipset Heat Sink with Clip for the modules TE0741-04 and 05
Référence de l’article: VAR-827003494
Numéro de produit du fabricant: 33013
Code douane: 84718000
Disponible pour expédition immédiate: 0
Disponible pour expédition immédiate: plus de 100
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Article situé / expédié de : Riedlingen, Allemagne
* Hors TVA hors Frais de livraison
Please check assembly instructions!
Wakefield-Vette's 27 x 27 x 23mm Pin Fin heat sink uses natural convection and thermal resistance of 9.44 C/Watt.
The heatsink is mounted on the chipset.
Features
- Heat sink with modified clip for precise fit on TE0741 (Revision 04/05)
- Heat dissipation material: aluminum
- Shape: Square, Pin Fins
- Fin type: elliptical pin
- Size: 27 x 27mm
- Height from base (height of pins): 22.65 mm
- Material Finish: Black Anodized
- Weight per piece: ca. 18 g
- Mounting method: Clip mounting
Scope of Delivery
- 1 x Heat Sink for Trenz Electronic FPGA Modules TE0741 Revision 04 and 05
- 1 x Heat conduction pad 25 x 25 mm
Additional Information
- Manufacturer: Wakefield-Vette
- Manufacturer's part number: 904-27-2-23-2-B-0
- Download Data SheetPin Fin Heat Sink
- Download Assembly Instructions
- Overview modules TE0741 series
- Trenz Electronic Wiki for 30313 heatsink
- Trenz Electronic Wiki Cooling Solutions Overview
- Support Forum
