Overview
Product Description
AXP500F Development Board adopts a System-on-Module (SOM) + carrier board structure. The SOM is based on the PANGO Titan3 PG3T500 FPGA (242K LUT6 + 484K registers), and features 2GB DDR4 and two 256Mb QSPI Flash chips. The carrier board provides FMC+, Gigabit Ethernet, USB-UART, 40-pin expansion connector, Micro SD card slot, JTAG, user buttons and LEDs. Ideal for high-speed acquisition, video processing, industrial control, and communication protocol validation.
Applications
● Communication
● Image and video processing
● High-speed Data Acquisition & Analysis
● Network information security
● Industrial Control
Key Features
System-on-Module
● PANGO Titan-3 PG2T390H
● Pluggable module with 2 x Panasonic board-to-board connectors
● 2 x 1 GByte (32-bit) DDR4 SDRAM
● 2 x 256Mb QSPI FlashBase Board
● 1 x FMC+ HPC (34 LVDS pairs + 16 transceivers)
● 1 x Gigabit Ethernet
● 1 x USB to UART
● 1 x Micro SD
● 1x 40-pin Expansion Port (40 pin 2.54mm spacing, with 34 IOs, connected to ALINX modules such as binocular cameras, TFT LCD screens, high-speed AD modules, etc.)
● 1 x JTAG
● 4 x User buttons
● 7 x LEDs
● 12V single supply
● Dimensions: 190 x 106 mm form factor
| Caractéristique technique | Valeur |
|---|---|
| ID de l’art. | 103819 |
| État | |
| Modèle | AXP500F V1.0 |
| Fabricant | Alinx Electronic Limited |
| Pays de fabrication | Chine |
| Contenu | 1 pièce |
| Poids | 1000 g |
| Poids net | 1000 g |
Development Board Features
Featuring the PANGOMICRO Titan3 PG3T500-6IFFBG676 Adaptive
Design-in Kit – The Fast Way to the Market, to get started with development straight out of the box.
The ALINX development board help shorten time-to-market for any PANGOMICRO Titan3 based application.
* The AXP500F development board consists of a P500 SoM and base board. If you want to purchase P500 SoM separately.
Please check the Relevant Products at the bottom of the page and click to learn more details.
What's Inside the Box
ALINX PANGO Titan3 PG3T500 development board and Some accessories
The FAN8060 Heatsink Kit is an optimal cooling solution for ALINX FPGA and modules – it is low-profile and covers the whole module surface.
| System-on-Module | 1 | Base Board | 1 |
|---|---|---|---|
| Mini USB Cable | 1 | Heatsink Kit (preinstalled) | 1 |
| 12V Power Adapter | 1 | USB Downloader Cable / set | 1 |
We offer complete documentations and a lot of demos and tutorials.
Please contact us should you have any need.
Alinx Electronic Limited
Alinx AXP500F FPGA Dev Board & Kit with Pango Titan3 PG3T500
AXP500F is a PANGO Titan3 FPGA SOM board (242K LUT6, 2GB DDR4) with FMC+, GbE, USB-UART, 40-pin I/O, SD, JTAG, buttons, LEDs. For high-speed acquisition, video, industrial, and communication.
Référence de l’article: VAR-827004409
Numéro de produit du fabricant: AXP500F V1.0
Code douane: 8471800000
L'article est expédié depuis Riedlingen, en Allemagne.
Articles fréquemment consultés
Vous aimerez peut-être aussi
