BGA Heat Sink - High Performance maxiFLOW/superGRIP - Low Profile

• Heat Sink Type: maxiFLOW
• Heat Sink Attachment: superGRIP
• For module
  • TE0808-05
  • TE0817
  • TE0818

Features

• Designed for 31 x 31 mm components
• Requires minimal space around the components perimeter, ideal for densely populated PCBs
• Allows the heat sink to be detached and reattached without damaging the component or the PCB, an important feature in the event a PCB may need to be reworked
• Strong, uniform attachment force helps achieve maximum performance from phase-changing TIMs
• Eliminates the need to drill mounting holes in the PCB

Thermal Performance

Product Detail

Dimension A: 31.00 mm

Dimension B: 31.00 mm

Dimension C: 17.50 mm

Dimension D: 54.9 mm

TIM: T766

Finish: Blue-Anodized

• Dimension A and B refer to component size
• Dimension C is the heat sink height from the bottom of the base to the top of the fin field
• Thermal performance data are provided for reference only. Actual performance may vary by
  application
• ATS certifies that this heat sink assembly is RoHS-6 and REACH compliant

Additional Information

• Manufacturer: ATS Advanced Thermal Solutions, Inc.
• Manufacturer's article number: ATS Part#: ATS-X50310P-C1-R0