Product Description
The AXRF47 development board adopts the AMD Xilinx Zynq UltraScale+ RFSoC Gen3 series ZU47DR FPGA chip, integrating high-performance RF data converters, programmable logic, an ARM Cortex-A53 processing subsystem, and multi-gigabit transceivers. It supports 8-channel 14-bit RF-ADCs with a maximum sampling rate of 5 GSPS, and 8-channel 14-bit RF-DACs with a maximum sampling rate of 9.85 GSPS. The RF interfaces offer wide frequency band support through configurable coupling and conditioning circuits. It provides a comprehensive RF signal chain that maximizes I/O channel density and bandwidth while leveraging heterogeneous processing capabilities for reduced power consumption.
Designed for large-scale MIMO systems, 5G baseband processing, fixed wireless access (FWA), cable TV access, test and measurement (T&M), satellite communications, phased-array radar/digital array radar (DAR), and other high-performance RF applications.
Applications
● 5G FR1/FR2 Baseband & RF Systems
● Wideband Spectrum Monitoring & Analysis
● Phased-Array Radar / Digital Array Radar (DAR)
● Satellite Communications
● Multi-channel RF Signal Processing (for SDR, test equipment)
● Test & Measurement (T&M) Systems
Key Features
System-on-Module
● AMD/Xilinx Zynq™ Ultrascale+™ RFSoC Gen3 XCZU47DR:
◆ 930K Logic Cells
◆ 8 x 14 bit 2.5GSPS RF-ADC
◆ 8 x 14 bit 9.85GSPS RF-DAC
◆ ARM® quad-core Cortex™-A53 up to 1.333GHz
◆ ARM® dual-core Cortex™-R5F up to 533MHz
◆ 16nm FinFET+ FPGA fabric
◆ Digital RF-ADC, RF-DAC● Pluggable module with 2 x Samtec board-to-board connectors
● 4 GByte (64-bit) DDR4 SDRAM on PS
● 2 GByte (32-bit) DDR4 SDRAM on PL
● 128 MB QSPI FlashBase Board
● 1 x M.2 Interface
● 1 x QSFP28 fiber optic
● 1 x SFP28 fiber optic
● 1 x Gigabit Ethernet
● RF MCXs
◆ 8 x 14bit RF-ADC @ 5.0 GSPS
◆ 8 x 14bit RF-DAC @ 9.85 GSPS● 1 x USB3.0
● 1 x UART on PS (USB to UART)
● 2 sets of PL IOs (x8), 1 set of PS IOs (x10)
● 1 x JTAG
● 1 x Micro SD
● EEPROM: 1Mbit I2C Serial EEPROM + 1 x Temperature sensor
● 4 x LED
● 1 x KEY (1 x RESET )
● 12V single supply
● Dimensions: 254 x 180 mm form factor
Development Board Features
Featuring the AMD/Xilinx's Zynq™ UltraScale+™ RFSoC XCZU47DR-2FFVE1156I Adaptive SoC
Design-in Kit – The Fast Way to the Market, to get started with development straight out of the box.
The ALINX development board help shorten time-to-market for any AMD/Xilinx Zynq™ UltraScale+™ RFSoC based application.
* The AXRF47 development board consists of a ACRF47 SoM and base board. If you want to purchase ACRF47 SoM separately.
Please check the Relevant Products at the bottom of the page and click to learn more details.
What's Inside the Box
ALINX AMD Xilinx Zynq™ UltraScale+™ RFSoC ZU47DR development board and Some accessories
Heatsink Kit is an optimal cooling solution for ALINX FPGA and SoC modules – it is low-profile and covers the whole module surface.
| System-on-Module | 1 | Base Board | 1 |
|---|---|---|---|
| Heatsink Kit (preinstalled) | 1 | 12V power supply | 1 |
| USB to Type-C cable | 1 | card reader | 1 |
| TF card | 1 |
