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Ela innovation
Blue PUCK T-PROBE Bluetooth Advanced Features ready version (IP65)
Item number VAR-827002675
Manufacturer Product Number: IDF25250-02B
Taric/custom code:
Available for immediate dispatch: 0
Expected dispatch delay beyond available stock: up to 2 weeks
Item located in and dispatched from: Riedlingen, Germany
USD 84.74
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Content
1 piece
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Item ID | 102248 |
Condition | New |
Model | IDF25250-02B |
Manufacturer | Ela innovation |
Manufacturing country | France |
Content | 1 piece |
Weight | 90 g |
Net weight | 70 g |
AXU2CGA Dev Board (preinstalled Heatsink Kit) with AMD Zynq US+ MPSoC XCZU2CG
USD 245.23 *
* Excl. VAT
excl.
Shipping
AXKU042 V2.0 FPGA Dev Board & Kit with AMD Kintex US+ XCKU040
USD 1,156.02 *
* Excl. VAT
excl.
Shipping
Special offer
TSW110 (5 x LAN ports, 10/100/1000 Mbps), Version: Standard Version
USD 27.06 *
* Excl. VAT
excl.
Shipping
MPSoC Module with Zynq UltraScale+ ZU17EG-2E, 8 GB DDR4 ECC(PS), 8 GB DDR4(PL) (TE0865-02-DGE43MA)
USD 5,723.31 *
* Excl. VAT
excl.
Shipping
AXU2CGA Dev Board (preinstalled Heatsink Kit) with AMD Zynq US+ MPSoC XCZU2CG
USD 245.23 *
* Excl. VAT
excl.
Shipping
AXKU042 V2.0 FPGA Dev Board & Kit with AMD Kintex US+ XCKU040
USD 1,156.02 *
* Excl. VAT
excl.
Shipping
Special offer
TSW110 (5 x LAN ports, 10/100/1000 Mbps), Version: Standard Version
USD 27.06 *
* Excl. VAT
excl.
Shipping
MPSoC Module with Zynq UltraScale+ ZU17EG-2E, 8 GB DDR4 ECC(PS), 8 GB DDR4(PL) (TE0865-02-DGE43MA)
USD 5,723.31 *
* Excl. VAT
excl.
Shipping
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Solderless Breadboard Kit: Small Solderless Breadboard with Two Power Rails(340-038 )
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Solderless Breadboard Kit: Small Solderless Breadboard with Two Power Rails(340-038 )
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