Alinx Electronic Limited

Z19 Dev Board & Kit based on AMD Zynq US+ MPSoC ZU19EG

● AMD/Xilinx Zynq™ Ultrascale+™ MPSoC: ◆ ARM® quad-core Cortex™-A53 up to 1.3 GHz ◆ ARM® dual-core Cortex™-R5 up to 533 MHz ◆ Mali-400MP2 GPU ◆ 16nm FinFET+ FPGA fabric ● 8 GByte (64-bit) DDR4 SDRAM on PS ● 1 x DDR4 SODIMM Card slot on PL ● 2 x 64 MB QSPI Flash ● 32 GB eMMC Flash ● 1 x M.2 Interface on PS ● 1 x DP Interface on PS ● 4 x QSFP28+ (per line 100Gbps) ● 2 x Gigabit Ethernet (1 x PS + 1 x PL) ● 2 x FMC HPC connectors (FMC1 has 36 pairs lvds io and 8 pairs GTH, FMC2 has 60 pairs lvds io and 8 pairs GTH) ● 1 x 2 lane MIPI on PL ● 1 x PCIe Gen 3 x 8 slot ● 2 x CAN Interfaces on PS ● 2 x RS485 Interfaces on PL ● 2 x USB3.0 on PS + 2 x USB2.0 on PS ● 3 x UART (2 x USB to USRT + FPC UART) ● 1 x JTAG ● 1 x Micro SD ● EEPROM: 4-Kbit I2C Serial EEPROM + 1 x Temperature sensor(LM75) ● 4 x SATA Interface ● 4 x SMA ● 1 x RTC(Real-time clock) ● 4 x LED (1 x PWR + 1 x DONE + 1 x PS + 1 x PL), 3 x KEY (1 x RST + 1 x PS + 1 x PL) ● 12V single supply ● Dimensions: 250 x 170 mm form factor


Item number VAR-827002845

Manufacturer Product Number: Z19

Taric/custom code: 8471 8000 00 0


Available for immediate dispatch: 0
Expected dispatch delay beyond available stock: up to 2 weeks

Item located in and dispatched from: Riedliengen, Germany


EUR 7,324.60 *
Content 1 piece
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The Z19 development board equipped with the AMD/Xilinx Zynq™ UltraScale+™ MPSoC-series XCZU19EG device, delivers standout performance with fast DDR4 SDRAM, eMMC Flash, QSPI Flash, PCIe, FMC HPC, QSFP28+, DP, M.2, CAN/RS485. Compatible with a multitude of FMC board (data acquisition, motor control, display camera interfaces, software defined radio), provide high-speed communication interface (PCIe, QSFP28+), high-speed storage (M.2) and video applications (DP).

Item ID 102405
Condition New
Model Z19
Manufacturer Alinx Electronic Limited
Manufacturing country China
Content 1 piece
Weight 1000 g
Net weight 1000 g
Customs tariff number 8471 8000 00 0

Applications ● Artificial Intelligence ● Automotive ● AV Broadcasting ● Deep learning ● Digital Signal Processing ● 5G Wireless and Wire Communication ● Data Centers ● Drive / Motion Control ● Industrial Internet of Thing ● Cloud Computing Security ● Machine Vision ● Medical Endoscop ● Video and Image Processing