Product Description
The AXVU13P FPGA development board equipped with the AMD/Xilinx Virtex Ultrascale+ series device, This board integrates three FMC+ connectors,Compatible with a multitude of FMC board (data acquisition, motor control, display camera interfaces, software defined radio) Provided users with a fully functional testing and verification platform
Provide high-speed communication ( PCIe ) and high-speed storage (SODIMM).
Applications
● Compute Acceleration
● Machine Learning and AI
● Network Acceleration
● Wired Communications
● 5G Baseband
● Radar
● Test and Measurement
● Emulation and Prototyping
Key Features
- ● AMD/Xilinx Virtex Ultrascale+™:
◆ 16nm FinFET FPGA fabric
◆ Integrated 100G Ethernet MAC and 150G Interlaken cores
◆ Gen3x16 Integrated PCIe® block for 100G applications
◆ 32 Gigabit GTY, Power Optimized Transceiver
◆ Up to 38 TOPs (22 TeraMACs) of DSP compute performance are optimized for fixed and floating point compute including INT8 for AI inference
● 1 x DDR4 SODIMM Card slot ( Supports up to 16GB DDR4 )
● 2 x 128 MB QSPI Flash
● 1 x PCIe® Gen3 ×16 - ● 3 x FMC+◆ FMC+1 has 120 IOs and 20 GTY
◆ FMC+2 has 120 IOs and 16 GTY
◆ FMC+3 has 164 IOs and 24 GTY
● 2 x SMA
● 1 x UART(USB to UART)
● 1 x JTAG
● 8 x LED
● 1 x KEY
● 12V single supply
● Dimensions: 251 x 111.15 mm form factor
Board Features
Featuring the AMD/Xilinx Virtex Ultrascale+™ XCVU13P-2FHGB2104I
Design-in Kit – The Fast Way to the Market, to get started with development straight out of the box.
The ALINX development board help shorten time-to-market for any AMD/Xilinx Kintex Ultrascale+™ based application.
What's Inside the Box
ALINX AMD Xilinx Virtex Ultrascale+™ XCVU13P FPGA development board and Some accessories
The FAN8060 Heatsink Kit is an optimal cooling solution for FPGA devices – it is low-profile and covers the whole XCVU13P device surface.
| Development Board | 1 | Heatsink Kit (preinstalled) | 1 |
|---|---|---|---|
| Mini USB Cable | 1 | USB Downloader Cable / set | 1 |
| 12V Power Adapter | 1 | PCle Fence | 1 |
