Product Description

The M2CG/3EG/4EV/5EV System-on-Chip(SoC) System-on-Module(SoM) combines high-end AMD/Xilinx Zynq™ UltraScale+™ MPSoC-series device with fast DDR4 SDRAM, eMMC Flash, parallel Quad-SPI Flash and thus forms a complete and powerful embedded processing system.

Applications

● Artificial Intelligence
● Automotive
● AV Broadcasting
● Deep learning
● Digital Signal Processing
● 5G Wireless and Wire Communication
● Data Centers
● Drive / Motion Control
● Industrial Internet of Thing
● Cloud Computing Security
● Machine Vision
● Medical Endoscop
● Video and Image Processing

Key Features

● AMD/Xilinx Zynq™ Ultrascale+™ MPSoC:
◆ ARM® quad-core Cortex™-A53
(Dual-core Arm Cortex-A53 for ACU2CG)
◆ ARM® dual-core Cortex™-R5F
◆ Mali-400 MP2 GPU (only for ZU3/4/5)
◆ H.264 / H.265 Video Codec (only for EV devices)
◆ 16nm FinFET+ FPGA fabric● Castellated-hole form factor
● 4 GByte (64-bit) DDR4 SDRAM on PS
● 32 MB QSPI Flash
● 8 GB eMMC Flash
● PCIe® Gen2 ×1 (PS)
● User I/Os
◆ 15 PS MIOs
◆ 102 FPGA I/Os (6 HD + 96 HP)● Work temperature range of -40°C to +85°C (only for ZU3/4/5)
● 12V single supply
● Dimensions: 70 x 50 mm form factor

Technical characteristic	Value
Item ID	102444
Condition	New
Model	M3EG
Manufacturer	Alinx Electronic Limited
Manufacturing country	China
Content	1 piece
Weight	1000 g
Net weight	1000 g
Customs tariff number	8471800000

Module Features

Featuring the AMD/Xilinx Zynq™ UltraScale+™ MPSoC XCZU3EG-1SFVC784I

ALINX AMD Xilinx Zynq UltraScale+ MPSoC XCZU5EV SoM system-on-module M5EV ZU5EV

* If you want to design a base board based on this Zynq™ UltraScale+™ MPSoC System-on-Module, you need to purchase FAN8060 Heatsink Kit, the FAN8060 Heatsink Kit is an optimal cooling solution for ALINX FPGA and SoC modules – it is low-profile and covers the whole module surface.

What's Inside the Box

ALINX AMD Xilinx Zynq™ UltraScale+™ MPSoC XCZU3EG System-on-Module/SoM

MPSoC SoM	1