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Trenz Electronic GmbH
Simple Base for TE0714 (TEBB0714-01)
Carrier board especially for TE0714 FPGA module with Hirose Ultra small SMT coaxial connectors
Item number VAR-827003652
Manufacturer Product Number: TEBB0714-01
Taric/custom code: 84718000
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Item located in and dispatched from: Riedlingen, Germany
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* Excl. VAT excl. Shipping
The Trenz Electronic TEBB0714 is a base board for test- and evaluation-purposes, especially for the Multi-gigabit transceiver units of the TE0714 module.
This base-board provides also through hole pads for pin headers to get access to the PL I/O-bank pins and further of the mounted Trenz Electronic3 x4 SoM.
Features
- Trenz TE0714 Module Socket (2x Samtec 100 Pin LSHM Series Connectors)
- 6-pin header for selecting XMOD/JTAG reference voltage
- OnePin Header 16 pol. (JTAG, MGT-CLK, Boot Mode, XADC, I/O's)
- OnePin Header 10 pol. (I/O's)
- SFP connector (1 MGT Lane, enhanced small form-factor pluggable, supports data transmission rates up to 10 Gbit/s)
- Four Hirose Ultra small SMT coaxial connectors, supports data transmission rates up to 6 Gbit/s
- Two Pin Header 50 pol. (FPGA Bank I/O's and Power)
- OnePin Header for FPGA Bank Power VCCIO34 (1.8 VOUT, 2.5 V, 3.3 VOUT)
- OnePin Header for FPGA Bank Power V_CFG (1.8 VOUT, 2.5 V, 3.3 VOUT)
- OnePin Header for VCCIO34 Power selection
- OneLDO voltage regulator 3.3 V to 2.5 V
- Twouser LEDs routed to IO-pins of the SoM (Red/Green)
- OneLED D3 (red) indicating 'Programming DONE'-signal from module's FPGA
- Soldering-pads J17 and J20 for optional pin headers for access to SoM's IO-bank-pins, usable as LVDS-pairs
- Soldering-pads J3 and J4 for optional pin headers for access to further interfaces and IO's of the SoM
Scope of Delivery
- 1 x TEBB0714-01 Trenz Electronic carrier board for TE0714
- 2 x Pin Header, straight, double row, 50 pins
Additional Information
All modules produced by Trenz Electronicare developed and manufactured in Germany.
