PCIe FMC Carrier with AMD Kintex 7 160T, DDR3 SODIMM ECC, GTX 10,31 Gb/s (TEF1001-03-B2IX4-M)

Note: Carrier without pads for conduction cooling!

The Trenz Electronic TEF1001-03-B2IX4-M is a PCIe FMC Carrier integrating anAMD Kintex-7 160T FPGA, 32 MByte SPI Flash, a 4 lane PCIe and a DDR3 SODIMM with ECC Socket.

It can also be equipped withKintex-7 325T or 410T, please ask for minimum quantities.

Key Features

• AMD Kintex-7 XC7K160T-2FFG676I FPGA SoC
• Speed Grade 2, FPGA package: FFG676 max. GTX transceiver rate: 10.3125 Gb/s
• Large number of configurable I/Os are provided via HPC FMC connector
  
  • 4 GTX high-performance transceiver
  • 2 x MGT transceiver clock inputs
  • 160 FPGA I/O's (80 LVDS pairs)
• On-board high-efficiency switch-mode DC-DC converters
• Lattice MachXO2 LCMXO2-1200HC System Controller CPLD
• 10 x User LEDs
• PCI Express x8 connector with 4 lane PCIe Gen 2 interface
• ANSI Vita 57.1 FMC High Pin Count (HPC) connector
• DDR3 SODIMM SDRAM with ECC socket with 64bit databus width
• 256 Mbit (32 MByte) Quad SPI Flash memory (for configuration and operation) accessible through:
  
  • FPGA
  • JTAG port (SPI indirect, bus width x4)
• FPGA configuration through:
  
  • JTAG connector
  • Quad SPI Flash memory
• Clocking
  
  • Si5338 programmable quad PLL clock generator - 4 outputs for MGT and PL clocks
  • 200MHz oscillator for DDR3 bank
• System management and power sequencing
  
  

Scope of Delivery

• 1 x TEF1001-03-B2IX4-M Trenz Electronic PCIe FMC Carrier withAMD Kintex-7 160T FPGA
• with mounted heat sink

Additional Information

• Manufacturer'sarticle name: TEF1001-03-B2IX4-M
• Trenz Electronic TEF1001 Wiki
• Support Forum