This product is not always in stock, but will be produced on customer order (on demand).
Please ask for any minimum quantities.

The predecessor of this article is TE0823-01-3PIU1FL. All changes are in the Product Change Notification (PCN).

This module is identical to variant TE0823-01-3PIU1MAexcept the lower 2.5 mm Samtec connectors.

The Trenz Electronic TE0823-01-3PIU1ML is an industrial-grade MPSoC module integrating a low power AMD Zynq UltraScale+ ZU3CG,1 GByte LPDDR4 SDRAM, 128 MByte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.

All this on a tiny footprint, smaller than a credit card, at the most competitive price. Modules in 4 x 5 cm form factor are fully mechanically and largely electrically compatible among each other.

All parts are at least industrial temperature range of -40C to +85C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Key Features

General

Rugged for shock and high vibration
Evenly spread supply pins for good signal integrity
Plug-on module with 2 x 100 pin and 1 x 60 pin Razor Beam High-Speed hermaphroditic Terminal/Socket Strips (low profile,2,5 mm)

SoC/FPGA

AMD/Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I (Low Power)
- Application Processor: Dual-core ARM Cortex-A53 MPCore
- Real-Time Processor: Dual-core ARM Cortex-R5 MPCore
Package: SFVC784
Device: ZU3
Engine: CG
Speed: -1LI (also non-low power assembly options possible)
Temperature range: industrial

RAM/Storage

Low power DDR4 on PS with 32 bit data width
128 MByte QSPI boot Flash in dual parallel mode
8GByte e.MMC memory with 8 bit data width
MAC address serial EEPROM with EUI-48 node identity

On Board

Lattice LCMXO2
PLL SI5338
Gigabit Ethernet transceiver PHY
Hi-speed USB2 ULPI transceiver with full OTG support

Interface

132 x HP PL I/Os (3 banks)
ETH
USB
4 GTR (for USB3, SATA, PCIe, DP)
Four high-speed serial I/O (HSSIO) interfaces supporting following protocols:
- PCI Express interface version 2.1 compliant
- SATA 3.1 specification compliant interface
- DisplayPort source-only interface with video resolution up to 4k x 2k
- USB 3.0 specification compliant interface implementing a 5 Gbit/s line rate
- 1 GB/s serial GMII interface
14 x PS MIOs
- MIO for UART
- thereof 6 MIO for SD card interface (default configuration)
- MIO for PJTAG
JTAG
Ctrl

Power

3.3V-5V main input
3.3V controller input
Variable bank I/O power input
All power supplies on board

Dimension

4 x 5 cmform factor

Other assembly options for cost or performance optimization plus high volume prices available on request.

Recommended Software

Vivado Enterprise Edition (paid version)

The Vivado Enterprise Edition is the full-featured version of the design suite and supports all AMD devices.

Overview Vivado Standard and Enterprise Edition

Development Support

There are different base boards available for this module.

Latest documentation, design support files and reference designs with source files are available for download free of charge.

Applications

Sensor Processing & Fusion
Motor Control
Low-cost Ultrasound
Traffic Engineering

Scope of Delivery

1 x TE0823-01-3PIU1ML Trenz Electronic MPSoC module withAMD Zynq UltraScale+ ZU3CG (low power) and low profile socket strips

Additional Information

Manufacturer's article number: TE0823-01-3PIU1ML
Trenz Electronic TE0823 Wiki
Samtec LSHM Razor Beam, High-Speed Hermaphroditic Terminal/Socket Strips, low profile 2.5 mm,
information concerning mating heights: Wiki, mounted on every 4 x 5 cm module from us marked with"LP" or "low profile".
Support Forum

All modules produced by Trenz Electronicare developed and manufactured in Germany.

Caractéristique technique	Valeur
ID de l’art.	103062
État
ID de l'ancien article	01967b9f3fc1714faeb362b6c3198e02
Modèle	TE0823-01-3PIU1ML
Fabricant
Pays de fabrication	Allemagne
Contenu	1 pièce
Poids	104 g

MPSoC Module with AMD Zynq UltraScale+ 3CG-L1I, 1 GByte LPDDR4, 4 x 5 cm, LP (TE0823-01-3PIU1ML)