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Alinx Electronic Limited

Alinx Z7-P Dev Board & Kit based on AMD Zynq US+ MPSoC ZU7EV

The Z7-P development board equipped with the AMD Zynq™ UltraScale+™ MPSoC-series XCZU7EV device, delivers standout performance with DDR4 SDRAM, eMMC Flash, QSPI Flash, PCIe, FMC HPC, M.2, DP, suitable for Artificial Intelligence, Computing, Automotive, Industrial, Video, and Communication, etc.


Artikelnummer VAR-827002849

Hersteller-Teilenummer: Z7-P V2.1

Taric/custom code: 8471800000


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Importierter Artikel wird versendet ab D-Riedlingen.


1.419,90 EUR *
Inhalt 1 Stück


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* Exkl. MwSt. exkl. Versandkosten

 Z7-P Development Board & Kit with AMD Zynq™ UltraScale+ MPSoC XCZU7EV ZU7EV

Product Description

The Z7-P/Z11-P development board equipped with the AMD/Xilinx Zynq™ UltraScale+™ MPSoC-series device, delivers standout performance with fast DDR4 SDRAM, eMMC Flash, QSPI Flash, PCIe, FMC HPC, DP, M.2.


Compatible with a multitude of FMC board (data acquisition, motor control, display camera interfaces, software defined radio), Provide high-speed communication (PCIe), high-speed storage (M.2) and video applications (DP).

Applications

  • ● Artificial Intelligence

    ● Automotive

    ● AV Broadcasting

  • ● Deep learning

    ● Digital Signal Processing

    ● 5G Wireless and Wire Communication

  • ● Data Centers

    ● Drive / Motion Control

    ● Industrial Internet of Thing

  • ● Cloud Computing Security

    ● Machine Vision

  • ● Medical Endoscop

    ● Video and Image Processing



Key Features

  • System-on-Module

    ● AMD/Xilinx Zynq™ Ultrascale+™ MPSoC:
    ◆ ARM® quad-core Cortex™-A53 up to 1.3 GHz
    ◆ ARM® dual-core Cortex™-R5F up to 533 MHz
    ◆ Mali-400 MP2 GPU
    ◆ H.264 / H.265 Video Codec (only for ZU7EV)
    ◆ 16nm FinFET+ FPGA fabric
    ● Pluggable module with 4 x Panasonic board-to-board connectors
    ● 4 GByte (64-bit) DDR4 SDRAM on PS
    ● 4 GByte (64-bit) DDR4 SDRAM on PL
    ● 64 MB QSPI Flash
    ● 32 GB eMMC Flash
  • Base Board

    ● 1 x FMC HPC connector (59 pairs lvds ios + 8 pairs GTH)
    ● 1 x PCIe® Gen3 ×8
    ● 1 x M.2 Card slot on PS
    ● 1 x DP Interface on PS
    ● 2 x Gigabit Ethernet (1 x PS + 1 x PL)
    ● 2 x UART (1 x PS + 1 x PL)(USB to UART)
    ● 1 x 40-pin Expansion Port (40 pin 2.54mm spacing, with 34 IOs, connected to ALINX modules such as binocular cameras, TFT LCD screens, high-speed AD modules, etc.)
    ● LED (1 x pwr + 1 x done + 1 x PL) + KEY (1 x RST + 1 x PS + 1 x PL)
    ● 12V single supply
    ● Dimensions: 222 x 106.7 mm form factor

Technisches Merkmal Wert
Art.-ID 102409
Zustand Neu
Modell Z7-P V2.1
Hersteller Alinx Electronic Limited
Herstellungsland China
Inhalt 1 Stück
Gewicht 1550 g
Netto-Gewicht 1500 g

Development Board Features

Featuring the AMD/Xilinx's Zynq™ UltraScale+™ MPSoC XCZU7EV-2FFVC1156I Adaptive SoC

Design-in Kit – The Fast Way to the Market, to get started with development straight out of the box.
The ALINX development board help shorten time-to-market for any AMD/Xilinx Zynq™ UltraScale+™ MPSoC based application.

Z7-P-development-board-AMD-Xilinx-Zynq™-UltraScale+-MPSoC-XCZU7EV.jpg

* The Z7-P development board consists of a ACU7EVC SoM and base board. If you want to purchase ACU7EVC SoM separately.
Please check the Relevant Products at the bottom of the page and click to learn more details.

What's Inside the Box

ALINX AMD Xilinx Zynq™ UltraScale+™ MPSoC XCZU7EV development board and Some accessories

The FAN8060 Heatsink Kit is an optimal cooling solution for ALINX FPGA and SoC modules – it is low-profile and covers the whole module surface.

System-on-Module1Base Board1
Heatsink Kit (preinstalled)1USB Downloader Cable / set1
12V Power Adapter1PCle Fence1
Mini USB Cable1Card Reader1
TF Card1